RCH VaporGen
A Hydrogen-Free, High-Flow Alternative to Bubbler Steam Generation
A high-flow steam generator for semiconductor wet oxidation engineered for greater precision, superior wafer uniformity, and a budget-friendly cost of ownership.
Higher flow. Tighter control. Standard DI Water. No Carrier Gas.
Why This Technology Matters
High-flow steam generation that rewrites the economics of semiconductor wet oxidation.
The semiconductor industry has long relied on conventional bubbler systems for wet oxidation, bubbling carrier gas through heated DI water to generate steam. It works, but flow is imprecise, limited, uniformity is variable, and the gas infrastructure adds cost and complexity.
RCH Associates' VaporGen heats ionized water directly in a metal-free flow path, delivering significantly higher steam flow with tighter precision, without a carrier gas and without the infrastructure that comes with one.
⚠️ Conventional Bubbler
✗ Limited total steam flow rate
✗ Limited precision control over flows
✗ Slower oxide growth
✗ Variable wafer-to-wafer and intra-wafer uniformity
✗ Costly gas infrastructure
✗ More Complex installation
✓ RCH VaporGen
✓ High-flow steam output - up to 12.5 SLM
✓ High-precision closed-loop PID control
✓ Faster oxide growth than bubblers
✓ Excellent wafer-to-wafer and intra-wafer uniformity
✓ No carrier gas needed - Just DI Water!
✓ Simplified installation
Key Benefits of VaporGen
High-Flow Steam Output: Up to 12.5 SLM maximum steam flow enabling accelerated oxide growth.
High-Precision Control: Precise, repeatable steam delivery for uniform, run-to-run process results.
No Carrier Gases: Eliminates carrier gas, reducing gas infrastructure and operating cost.
Improved Oxide Growth Rates: Establishes high steam flow compared to bubblers for full tube saturation and higher oxidation rates.
Superior Wafer Uniformity:Full tube saturation leads to superior wafer-to-wafer and within-wafer uniformity.
Compact, Self-Contained Design:Sized to easily install inside the tool or furnace cabinet requiring only power and DI water in.
Furnace Compatibility: Compatible with a wide range of horizontal and vertical furnace configurations, as well as other applications.
Wide Range of Process Applications: VaporGen can be utilized for a variety of applications including: Gate Oxide, LOCOS, Sacrificial Oxide Formation, Traditional Wet Oxidation, Solar Cell Manufacturing, and more.
Technical Specifications
VaporGen at a Glance
Input Power: 110VAC 10a or 220VAC 5a
Dimensions: 6.15” W x 12.75” L x 10.00” D
Input DI H2O: 15-20 psig via 1/4” Compression
Steam Output Connection: 1/2” PTFE
Mounting: Compact form factor allows for simple installation inside tool or source cabinet
Steam Generation: Direct liquid water heating; No torch or bubbler required
Steam Flow Rate: Up to 12.5 SLM pure steam flow
Control Method: Precision closed-loop PID control
Control Interface: Local control or Remote Interface via DB-15 connector.
Alarm Outputs: Alarm Indicator and Digital Output
Warranty & Support
The field-proven VaporGen is fully engineered, manufactured, serviced and warranted by RCH Associates, Inc. For specific information on the VaporGen as it applies to your processing and equipment requirements for production, pilot-line or research applications, please contact RCH Associates.